Fine Grinding Machinery

Fine grinding was originally developed for wafer thinning operation of the semiconductor devise just before dicing into the individual dies. This process is called fine grinding or micro finish grinding or more commonly flat honing. The process is very similar to traditional lapping and can be used to even replace it. It is a precision finishing technology that provides flatness, parallelism, surface finish, and size tolerances.

Process
It works with the same precision as lapping. The cutting tool has an upper and a lower wheel having fixed abrasive diamond or Carbon Boron Nitride (CBN) suspended in resin, metal, and vitrified bonds to grind a wide range of materials to very rigid specifications.

Work pieces are guided between the upper and lower working wheel. It is speedier than the traditional lapping. Fine-ground surface has cross-hatched marks and Stock removal caused by micro grooving / -cutting. The coolant in the process can be recycled.